PODCAST: USB 3.0 Design Challenges

 By John Edwards, Contributing Editor

By 2013, SuperSpeed USB will represent approximately 30 percent of the USB market, according to industry research firm In-Stat. The new USB 3.0 specification promises a top data transfer rate of 5 Gbits/s. Learn more in this podcast—Electronic Design contributing editor John Edwards speaks with Chuck Trefts at Ellisys, a USB test and measurement company.

Power-One Licenses IP To PMBus POL Module Maker

 By Don Tuite, Analog & Power Editor

The most unexpected news on Monday came from the Darnell Group’s Digital Power Forum, being held this week in Santa Ana, Calif. A company offering digital point-of-load (POL) regulator modules that use PMBus for control and telemetry has been licensed to use Power-One’s Zbus patents.

Which Compression Format Provides The Most Bang For The Buck?

 By Al Wegener, Samplify Systems

We all want value for our money, especially during the current economic downturn. But when it comes to compression algorithms, what’s the best way to determine value? Let’s take a look at audio compression algorithms and figure out which ones provide the best “bang for the buck.”

Deeply Embedded Devices: The Internet Of Things

 By Rodger Richey, Microchip Technology And Mark Wright, ZeroG Wireless

The “Internet of things” is about connecting products that create, store, and consume data via the Internet. Implementing smart IP connectivity schemes will improve efficiency and deliver better performance, which becomes more critical as the Internet of connected things approaches a billion by 2011.

Pico-ITXe And Pico-I/O Specs Guide Small, Stackable Embedded Designs

The Small Form Factor Special Interest Group (SFFSIG) announced the availability of revision 1.0 of both the Pico-ITXe and Pico-I/O specifications for small, rugged, stackable embedded systems. SFFSIG is a collaboration of embedded component, board, and system suppliers.