ED_ELECTRONIC DESIGN UPDATE Penton Media October 14, 2009 If you want to view this on the web go to: http://enews.penton.com/enews/electronicdesign/v/911 ---------------------------------------- ADVERTISEMENT LabVIEW 2009 - Do More with Next Generation Technologies (http://www.ni.com/labview/whatsnew/?metc=mtmp57) LabVIEW 2009 simplifies development challenges of parallel hardware architectures with multicore programming enhancements and new virtualization technology. Access other new features, including the ability to run LabVIEW code on NI wireless sensor networks and deploy advanced control algorithms with real-time math capabilities to real-time targets. Learn more about LabVIEW 2009 and download the free evaluation software. (http://www.ni.com/labview/whatsnew/?metc=mtmp57) ---------------------------------------- INDUSTRY VIEWPOINT --Outsourcing SoC Network Design Just Makes Sense By Frank Ferro, Sonics Inc. The ability to squeeze more into an SoC is forcing semiconductor developers to look at IP from outside sources. Most design starts are targeting a 45-nm process, which means an embedded SoC can easily have 50 or even 100 cores. Clearly no one company, except for some of the very largest, can develop all the technology blocks needed in these complex devices. To view the full article go to: http://electronicdesign.com/Articles/Index.cfm?AD=1&ArticleID=21962&bypass=1 --Chip Makers Target LTE By Linley Gwennap, Linley Group With backing from nearly all of the leading cellular-service providers in the world, Long-Term Evolution (LTE) is clearly the 4G technology of choice for mobile data. Some handset makers are developing their own LTE ASICs, but most LTE devices will use standard baseband processors from the leading chip suppliers. That's why chip makers don't want to be left behind in the 4G transition. To view the full article go to: http://electronicdesign.com/Articles/Index.cfm?AD=1&ArticleID=21878&bypass=1 2009 Readers' Choice Survey 2009 saw many significant innovations. Now it's time to choose the best of the bunch. Our December 1 Best Electronic Design issue will feature a look at the best Leapfrog technology of the year and name the year's best Idea for Design, both chosen by you, our readers. What was the best Leapfrog story of the year? Go to this survey (http://www.zoomerang.com/Survey/?p=WEB229PK9SN87Q) for a list of nominees, determined by traffic on www.electronicdesign.com, and select your favorite. And, what was the best Idea for Design of the year? Go to this survey (http://www.zoomerang.com/Survey/?p=WEB229PKQ6NGYL) for the nominees, and choose the best. Thank you for your input! ---------------------------------------- ADVERTISEMENT Samtec Releases Micro Backplane Interface Design Guide (http://www.samtec.com/catalog) Samtec has released its new Micro Backplane Design Guide detailing how high speed and high density board-to-board and panel-and-I/O interface solutions can be used for add-on boards and creative solutions to increasing I/O density. Board-to-board solutions include perpendicular and coplanar applications for high-speed edge card and Samtec's rugged two-piece Edge Rate connector system. High density solutions are addressed with SeaRay open pin field arrays, while Q2_ integrated ground plane connectors address traditional power and ground applications within high speed interconnects. Click here for more info. (http://www.samtec.com/catalog) ---------------------------------------- PEASE PORRIDGE --Bob's Mailbox: Readers Respond To "What's All This Little Guy Stuff, Anyhow?" By Bob Pease Columnist Bob Pease responds to reader comments regarding his August article about the benefits of spending time on the small-volume customers he refers to as the "Little Guy." To view the full article go to: http://electronicdesign.com/Articles/Index.cfm?AD=1&ArticleID=21940&bypass=1 POWER DESIGN --Load-Sharing Power Converters Tackle Higher Output Power And Fault Tolerance By Tom Curatolo, Vicor Corp. Designers parallel their power supplies to increase system power output or to provide fault tolerance. When both power supplies are load sharing, for example, the two supplies share the dissipated heat, improving reliability. Furthermore, if one power supply goes offline, the other one is coming from an already loaded state, so the perturbation on the output is not significant. To view the full article go to: http://electronicdesign.com/Articles/Index.cfm?AD=1&ArticleID=21952&bypass=1 ---------------------------------------- ADVERTISEMENT Read White Paper: Increasing Bandwidth and Connectivity in Small Form Factor, High-Performance Embedded Applications (http://www.accelacomm.com/jaw/enewstext/9/50602411/) Embedded designers of high-performance systems must incorporate growing numbers and types of I/O in smaller and smaller off-the-shelf and semi-custom boards, while keeping their design platforms flexible enough to accommodate a variety of designs, including some that must maintain compatibility with legacy I/O. The SUMIT interconnect technology provides such a solution and is supported by the SFF-SIG. Read this white paper from Versa Logic Corporation to learn about the I/O-Centric, High-Speed SUMIT Interconnect Standard. Download now. (http://www.accelacomm.com/jaw/enewstext/9/50602411/) ---------------------------------------- Vote For The 2009 Engineering Hall of Fame Inductees! (http://www.zoomerang.com/Survey/?p=WEB229K3HLWFGU) Engineering giants such as Jack Kilby, George Philbrick, and Bob Pease are already members of Electronic Design's Engineering Hall of Fame. Now it's time to induct the 2009 class. Who deserves the honor? It's up to you! Read over our list of nominees and vote for your favorites (http://www.zoomerang.com/Survey/?p=WEB229K3HLWFGU). We'll report on the winners in our December 1 issue. TECHVIEW --SoC Integrates DSL, Wi-Fi, And Cordless Phone Functionality By Louis E. Frenzel, Communications Editor Broadcom's BCM6362 SoC offers an ADSL2+ modem, an 802.11n WLAN transceiver, a Digital Enhanced Cordless Telecommunications (DECT) cordless telephone circuit, and Voice over Internet Protocol in a single 65-nm device. Designers can combine a separate modem, wireless access point, and cordless telephone into one convenient, lower-cost home networking solution. To view the full article go to: http://electronicdesign.com/Articles/Index.cfm?AD=1&ArticleID=21967&bypass=1 ---------------------------------------- Tektronix's MSO70000 Series Mixed-Signal Scopes View Video: http://electronicdesign.com/products/chris_loberg.html ---------------------------------------- ---------------------------------------- • National Instruments (http://www.ni.com/labview/whatsnew/?metc=mtmp57) • Samtec, Inc. (http://www.samtec.com) • VersaLogic Corporation (http://www.accelacomm.com/jaw/enewstext/9/50602411/) ---------------------------------------- ---------------------------------------- Subscribe To Electronic Design http://electronicdesign.com/Subscribe/ ---------------------------------------- ---------------------------------------- Myths & Realities Of Real-Time Linux Software Systems Brought to you by Versa Logic Corporation Read now! http://www.accelacomm.com/jaw/enewsrail/9/50602460/ Increasing Bandwidth And Connectivity In Small Form Factor, High-Performance Embedded Applications Brought to you by Versa Logic Corporation Read now! http://www.accelacomm.com/jaw/enewsrail/9/50602411/ ---------------------------------------- ---------------------------------------- Watch Webcast: Upgrading To Li-ion From Sealed Lead Batteries To Optimize Portable Performance Watch live on October 28, 2009. Register now: http://w.on24.com/r.htm?e=166341&s=1&k=6DC4EAB1B1D3311482223138D22885B7&partnerref=enewsrightrail Sponsored by Micro Power ---------------------------------------- ---------------------------------------- Soft Servo Motion Control and Robotic Hand Published: October 7, 2009 Watch now: http://engineeringtv.com/blogs/etv/archive/2009/10/07/soft-servo-motion-control-and-robotic-hand.aspx ---------------------------------------- ABOUT OUR NEWSLETTER Electronic Design UPDATE e-Newsletter Contacts Editor: Joe Desposito (mailto:joe.desposito@penton.com) Advertising/Sponsorship Opportunities: Bill Baumann (mailto:bill.baumann@penton.com) To unsubscribe click here: http://email.electronicdesign.com/webforms/newsletter/unsub/?email=#email#&lid=#list_id#&mid=#message_id# To change your e-mail address, send an e-mail, indicating your old e-mail address as well as your new one, to: mailto:newsletters@electronicdesign.com. 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