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By Frank Ferro, Sonics Inc.
The ability to squeeze more into an SoC is forcing
semiconductor developers to look at IP from outside sources. Most design
starts are targeting a 45-nm process, which means an embedded SoC can
easily have 50 or even 100 cores. Clearly no one company, except for
some of the very largest, can develop all the technology blocks needed
in these complex devices.
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ARTICLE
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By Linley Gwennap, Linley Group
With backing from nearly all of the leading cellular-service
providers in the world, Long-Term Evolution (LTE) is clearly the 4G
technology of choice for mobile data. Some handset makers are developing
their own LTE ASICs, but most LTE devices will use standard baseband
processors from the leading chip suppliers. That's why chip makers
don’t want to be left behind in the 4G transition.
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2009 Readers' Choice
Survey
2009 saw many significant innovations. Now it's time to choose the best
of the bunch. Our December 1 Best Electronic Design issue will
feature a look at the best Leapfrog technology of the year and name the
year's best Idea for Design, both chosen by you, our readers.
What was the best Leapfrog story of the year? Go to this
survey for a list of nominees, determined by traffic on
www.electronicdesign.com, and select your favorite.
And, what was the best Idea for Design of the year? Go to this
survey for the nominees, and choose the best.
Thank you for your input!
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By Bob Pease
Columnist Bob Pease responds to reader comments regarding his
August article about the benefits of spending time on the small-volume
customers he refers to as the "Little Guy."
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ARTICLE
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By Tom Curatolo, Vicor Corp.
Designers parallel their power supplies to increase system
power output or to provide fault tolerance. When both power supplies are
load sharing, for example, the two supplies share the dissipated heat,
improving reliability. Furthermore, if one power supply goes offline,
the other one is coming from an already loaded state, so the
perturbation on the output is not significant.
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ARTICLE
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Vote For
The 2009 Engineering Hall of Fame Inductees!
Engineering giants such as Jack Kilby, George Philbrick, and Bob Pease
are already members of Electronic Design’s Engineering Hall
of Fame. Now it’s time to induct the 2009 class. Who deserves the
honor? It’s up to you! Read over our list of nominees and vote for your
favorites. We’ll report on the winners in our December 1
issue.
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By Louis E. Frenzel, Communications
Editor
Broadcom’s BCM6362 SoC offers an ADSL2+ modem, an 802.11n
WLAN transceiver, a Digital Enhanced Cordless Telecommunications (DECT)
cordless telephone circuit, and Voice over Internet Protocol in a single
65-nm device. Designers can combine a separate modem, wireless access
point, and cordless telephone into one convenient, lower-cost home
networking solution.
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ARTICLE
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