ED_ELECTRONIC DESIGN UPDATE Penton Media November 11, 2009 If you want to view this on the web go to: http://enews.penton.com/enews/electronicdesign/v/954 ---------------------------------------- ADVERTISEMENT High-Speed/high-density cable solutions for your next design (http://www.fci.com/highspeed) FCI addresses the need for cost-effective, high-speed and high-density cable assemblies. FCI's high-speed/high-density product offerings are available in backpanel, mezzanine, I/O, coplanar, orthogonal and cable-to-board versions. As a pioneer in high-speed/high-density connectors, FCI is spearheading the drive to 25 Gb/s and 100 Gb/channel transmission speeds. For your evolving signaling requirements for new communications and data equipment designs, FCI has the right technologies for your needs. Click here for more info. (http://www.fci.com/highspeed) ---------------------------------------- LAB BENCH ONLINE --E Ink Talks About ePaper By Bill Wong, Embedded/Systems/Software Editor Bill Wong chats with Sriram Peruvemba, vice president of marketing for E Ink Corp. E Ink's ePaper gives the Amazon Kindle its long battery life and great view. The Kindle is just one of many eBooks that take advantage of ePaper. Sony's Reader Pocket Edition and Barnes and Noble's nook are other examples. To view the full article go to: http://electronicdesign.com/Articles/Index.cfm?ArticleID=22107&bypass=1 TECHVIEW --PXI Instrumentation Suite Stands Up To Mixed-Signal Semiconductor Test Challenges By David Maliniak, EDA/Test Editor National Instruments has launched a series of PXI-based modular instruments that combine with the company's LabVIEW software to create a highly flexible system that shines with analog/mixed-signal test, where stimuli types can be out of the ordinary (think MEMS test), volumes are extremely high, and test costs must be correspondingly low. To view the full article go to: http://electronicdesign.com/Articles/Index.cfm?ArticleID=22106&bypass=1 VIDEO --An Interview With IMEC CEO Luc Van den hove Editor-in-Chief Joe Desposito speaks with IMEC CEO Dr. Luc Van den hove at the 2009 IMEC Technology Conference. Van den hove assumed his position back in June in the midst of the research center's silver anniversary and a worldwide recession. Van den hove talks about IMEC, the challenges it faces during these difficult economic times and contemplates the challenges of the next 25 years. To view the full article go to: http://electronicdesign.com/Articles/Index.cfm?ArticleID=22058&bypass=1 ---------------------------------------- ADVERTISEMENT Samtec Rugged/Power Interconnect Capabilities Guide (http://www.samtec.com/catalog) Detailed in a new guide, Samtec's line of Rugged and Power interconnects are designed specifically to address the board-to-board, cable-to-board, and panel & I/O needs of applications requiring high power or highly durable solutions. These products are particularly well suited for Solar and LED applications, Military/Aerospace/Avionics and Automotive industries, and for Medical Equipment & Devices. Click here for more info. (http://www.samtec.com/catalog) ---------------------------------------- Electronic Design Pop QuizSponsored by Toshiba Do you have an eye for camera design? Do you understand image sensor technology, dynamic range, aliasing and more? Then take the professor's challenge and test your "camera smarts" to be entered to win one of six $50.00 Amazon gift cards! Take this quiz now. (http://popquiz.electronicdesign.com/toshiba-image-sensor/default.aspx) Electronic Design Pop QuizSponsored by Intel (http://connectthis.intel.com/) The embedded Internet is bringing transformative changes to the embedded world. The era of intelligent connectivity is dawning. And the industry is about to hit the fast-forward button. Are you in? Take the quiz to test your knowledge. (http://popquiz.electronicdesign.com/intel_Oct09/) NEWS --Micronail Chip Links Electronics With Bio Cells IMEC, a nanotechnology research center based in Leuven, Belgium, has developed a unique microchip with microscopic nail structures that enables close communication between electronics and biological cells. The new chip is a mass-producible, easy-to-use tool for electrophysiology research, such as research on the functioning and dysfunctioning of the brain. To view the full article go to: http://electronicdesign.com/Articles/Index.cfm?ArticleID=22104&bypass=1 ---------------------------------------- ADVERTISEMENT Have you visited the Intersil Media Center? (http://w.on24.com/r.htm?e=155687&s=1&k=CE0124D2E071B334AAE99989E23813E2&userreg=n&partnerref=enewstext) Whether you are interested in videos on why we need Chopper Amps or a selection guide that has the world's largest selection of Digitally Controlled Potentiometers (DCPs), it is all inside the Intersil Media Center. A one-time registration gives you access to loads of how-to design videos, brochures, selection guides and more. Check it out today! (http://w.on24.com/r.htm?e=155687&s=1&k=CE0124D2E071B334AAE99989E23813E2&userreg=n&partnerref=enewstext) ---------------------------------------- DESIGN FAQ --Non-Isolated Point-Of-Load Regulator Modules By Don Tuite, Analog & Power Editor Analog & Power Editor Don Tuite answers some frequently asked questions about non-isolated point-of-load regulator modules, including: * What is the Intermediate Bus Architecture? * Functionally, what does a POL regulator comprise? * How do newer packages deal with the switching inductor? * And more! To view the full article go to: http://electronicdesign.com/Articles/Index.cfm?AD=1&ArticleID=22013&bypass=1 FOCUS ON EMERGING TECHNOLOGY --Enabling LED Lighting Of The Future With Established Infrastructures Of Today (http://electronicdesign.com/Articles/Index.cfm?AD=1&ArticleID=22105&bypass=1) Sponsored Editorial The use of LEDs in lighting systems brings many benefits, from energy savings to durability and longer life. However, the adoption and growth of LED lighting depend on its ability to connect to existing infrastructures. NEC Electronics offers MCUs with specialized built-in hardware that allows new LED lighting to fit in established systems. READ THE FULL ARTICLE (http://electronicdesign.com/Articles/Index.cfm?AD=1&ArticleID=22105&bypass=1) Brought to you by (http://www.semiconductorstore.com/) ---------------------------------------- How To Measure Load Regulation View Video: http://ad.doubleclick.net/clk;218444412;41549093;e?http://tipowerforprocessors.com/measure-load-regulation-1015/ Digital Power For Xilinx FPGAs: eLAB Series Pt. 1 View Video: http://ad.doubleclick.net/clk;218549718;41652741;o?http://tipowerforprocessors.com/xilinx-fpga-power-1015/ ---------------------------------------- ---------------------------------------- • FCI (http://www.fci.com) • Samtec, Inc. (http://www.samtec.com) • Intersil (http://w.on24.com/r.htm?e=155687&s=1&k=CE0124D2E071B334AAE99989E23813E2&userreg=n&partnerref=enewstext) ---------------------------------------- ---------------------------------------- Subscribe To Electronic Design http://electronicdesign.com/Subscribe/ ---------------------------------------- ---------------------------------------- Download White Paper: Understanding Long-Term Evolution Fundamentals And Measurement Challenges Brought to you by Rohde & Schwarz Read now! http://www.accelacomm.com/jaw/enewsrtrail/9/80573157/&ord=9682010 Download White Paper: Myths & Realities Of Real-Time Linux Software Systems Brought to you by Versa Logic Corporation Read now! http://www.accelacomm.com/jaw/enewsrail/9/50602460/ ---------------------------------------- ---------------------------------------- Webcast On Demand: A New Approach To Mobile Design That Reduces Dev Time Learn about trends in display panel and CMOS image sensor technology, high-speed interfaces, and more. Watch now: http://w.on24.com/r.htm?e=164850&s=1&k=CF8E75C936AB2993309D9E193D76EEA4&partnerref=enewsrightrail Sponsored by Toshiba ---------------------------------------- ---------------------------------------- SOLARC Low Power Solar Modules Published: November 9, 2009 Watch now: http://engineeringtv.com/blogs/etv/archive/2009/11/09/solarc-low-power-solar-modules.aspx ---------------------------------------- ABOUT OUR NEWSLETTER Electronic Design UPDATE e-Newsletter Contacts Editor: Joe Desposito (mailto:joe.desposito@penton.com) Advertising/Sponsorship Opportunities: Bill Baumann (mailto:bill.baumann@penton.com) To unsubscribe click here: http://email.electronicdesign.com/webforms/newsletter/unsub/?email=#email#&lid=#list_id#&mid=#message_id# To change your e-mail address, send an e-mail, indicating your old e-mail address as well as your new one, to: mailto:newsletters@electronicdesign.com. 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