ED_EUROPE NEWSLINE_ A Penton Media Property January 28, 2010 If you want to view this on the web go to: http://enews.penton.com/enews/electronicdesign/v/1049 EDITOR'S COMMENT --Latest Blackfins Score High On Berkeley Benchmark Analysis By Paul Whytock, Editor-in-Chief Analog Devices (ADI) has released the latest members of its Blackfin family of processors for converged digital-signal and control-processing applications. ADI claims its new Blackfin BF50x series devices can deliver more performance than similar priced processors with integrated analog-to-digital converters (ADC) and flash memory. Customers are currently sampling the product. 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With NXP's integrated IC solutions you take advantage of the opportunities this lighting revolution is bringing. ---------------------------------------- NEWS --UML/SysML-based Design Environment Is Based On Artisan Studio By Paul Whytock, Editor-in-Chief Artisan Software Tools has announced the first technology solution to emerge from the European Union's Framework7 SATURN project -- a UML/SysML-based hardware/software co-design environment based on Artisan Studio. To view the full article go to: http://electronicdesign.com/article//uml_sysml_based_design_environment_is_based_on_artisan_studio.aspx?nl=1 ---------------------------------------- ADVERTISEMENT Access the new Embedded Innovator magazine now (http://edc.intel.com/community/embedded-innovator/) Don't miss this valuable resource for embedded engineers on the hottest embedded news, solutions and designs. Inside this magazine: Making Software Simpler, Outsmarting the Recession, The Atom-Powered Car, Consolidating Hardware with Virtualization, Developing Innovative Digital Signage and more! Read Embedded Innovator now. (http://edc.intel.com/community/embedded-innovator/) ---------------------------------------- --Yokogawa And Hitec Collaborate On High-Current Power Measurements By Paul Whytock, Editor-in-Chief Yokogawa Europe has teamed-up with Hitec Power Protection to develop a range of high-current power measurement solutions combining Yokogawa's family of power analysers with Hitec's zero-flux range of DC current-transformer based sensors. 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(http://www.irf.com/whats-new/nr100121.html) ---------------------------------------- --TSMC Helps LSI Reduce Leakage By 25% On Next Generation Product By Paul Whytock, Editor-in-Chief The Taiwan Semiconductor Manufacturing Company (TSMC) has announced that the LSI Corporation achieved over 25% overall leakage reduction in a next generation product by implementing TSMC's PowerTrim power-optimization technology on the company's 65nm low-power (LP) process. To view the full article go to: http://electronicdesign.com/article//_tsmc_helps_lsi_reduce_leakage_by_25_on_next_generation_product_.aspx?nl=1 --DesignWare System-Level Library Adds SuperSpeed USB 3.0 Support By Paul Whytock, Editor-in-Chief Synopsys has launched SuperSpeed USB 3.0 transaction-level models (TLM) supporting the Open SystemC Initiative (OSCI) TLM-2.0 API specification. The models are TLM representations of the Synopsys DesignWare SuperSpeed USB 3.0 Device and xHCI Host Controller IP. To view the full article go to: http://electronicdesign.com/article//designware_system_level_library_adds_superspeed_usb_3_0_support.aspx?nl=1 --Pyroelectric Infrared Sensor Claimed As World's Smallest By Paul Whytock, Editor-in-Chief The latest version of Murata's pyroelectric infrared (PIR) sensor is claimed by the company to be the world's smallest at 5.0 x 4.7 x 2.4 mm, enabling the sensor to be used in compact, low-profile electronic devices and equipment. To view the full article go to: http://electronicdesign.com/article//pyroelectric_infrared_sensor_claimed_as_world_s_smallest.aspx?nl=1 HOT TOPICS --Designer Decisions: Selecting Timing Circuits For Modern Communications By James Wilson, Silicon Laboratories Inc. Modern timing architectures used in next-generation networking and wireless infrastructure applications have become increasingly complex. Some of the reasons for the shift include the need to support a broader range of end applications or meet global standards with a single device. A big opportunity for IC vendors is to address the need for integrated CMOS solutions aimed at next-generation networking equipment. Some analysts put the market opportunity at $1.5 billion in the next few years. To view the full article go to: http://electronicdesign.com/article//designer_decisions_selecting_timing_circuits_for_modern_communications.aspx?nl=1 ABOUT THIS NEWSLETTER Electronic Design Europe NewsLine Contacts Editor: Paul Whytock (mailto:Paul.Whytock@penton.com) Advertising/Sponsorship Opportunities: Paul Milnamow (mailto:Paul.Milnamow@penton.com) To unsubscribe click here: http://email.electronicdesign.com/webforms/newsletter/unsub/?email=#email#&lid=#list_id#&mid=#message_id# To change your e-mail address, send an e-mail, indicating your old e-mail address as well as your new one, to: mailto:newsletters@electronicdesign.com. 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