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Electronic Design Europe NewsLine: Global Electronics Intelligence for European Design Engineers
In the January 28, 2010 Issue:
 Latest Blackfins Score High On Berkeley Benchmark Analysis
 UML/SysML-based Design Environment Is Based On Artisan Studio
 Yokogawa And Hitec Collaborate On High-Current Power Measurements
 TSMC Helps LSI Reduce Leakage By 25% On Next Generation Product
 DesignWare System-Level Library Adds SuperSpeed USB 3.0 Support
 Pyroelectric Infrared Sensor Claimed As World's Smallest
 Designer Decisions: Selecting Timing Circuits For Modern Communications

Editor's Comment

Latest Blackfins Score High On Berkeley Benchmark Analysis

By Paul Whytock, Editor-in-Chief

Analog Devices (ADI) has released the latest members of its Blackfin family of processors for converged digital-signal and control-processing applications. ADI claims its new Blackfin BF50x series devices can deliver more performance than similar priced processors with integrated analog-to-digital converters (ADC) and flash memory. Customers are currently sampling the product.

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News

UML/SysML-based Design Environment Is Based On Artisan Studio

By Paul Whytock, Editor-in-Chief

Artisan Software Tools has announced the first technology solution to emerge from the European Union’s Framework7 SATURN project—a UML/SysML-based hardware/software co-design environment based on Artisan Studio.

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Yokogawa And Hitec Collaborate On High-Current Power Measurements

By Paul Whytock, Editor-in-Chief

Yokogawa Europe has teamed-up with Hitec Power Protection to develop a range of high-current power measurement solutions combining Yokogawa's family of power analysers with Hitec's zero-flux range of DC current-transformer based sensors.

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TSMC Helps LSI Reduce Leakage By 25% On Next Generation Product

By Paul Whytock, Editor-in-Chief

The Taiwan Semiconductor Manufacturing Company (TSMC) has announced that the LSI Corporation achieved over 25% overall leakage reduction in a next generation product by implementing TSMC's PowerTrim power-optimization technology on the company's 65nm low-power (LP) process.

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DesignWare System-Level Library Adds SuperSpeed USB 3.0 Support

By Paul Whytock, Editor-in-Chief

Synopsys has launched SuperSpeed USB 3.0 transaction-level models (TLM) supporting the Open SystemC Initiative (OSCI) TLM-2.0 API specification. The models are TLM representations of the Synopsys DesignWare SuperSpeed USB 3.0 Device and xHCI Host Controller IP.

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Pyroelectric Infrared Sensor Claimed As World's Smallest

By Paul Whytock, Editor-in-Chief

The latest version of Murata's pyroelectric infrared (PIR) sensor is claimed by the company to be the world's smallest at 5.0 x 4.7 x 2.4 mm, enabling the sensor to be used in compact, low-profile electronic devices and equipment.

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Hot Topics

Designer Decisions: Selecting Timing Circuits For Modern Communications

By James Wilson, Silicon Laboratories Inc.

Modern timing architectures used in next-generation networking and wireless infrastructure applications have become increasingly complex. Some of the reasons for the shift include the need to support a broader range of end applications or meet global standards with a single device. A big opportunity for IC vendors is to address the need for integrated CMOS solutions aimed at next-generation networking equipment. Some analysts put the market opportunity at $1.5 billion in the next few years.

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This issue brought
to you by:
NXP Semiconductors

Intel Corporation

International Rectifier

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