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Bob Pease, Contributing Editor
We continue to mine dusty volumes for missing columns that pre-date our Web site. In this edition, Bob recalls a conversation with George Philbrick about pre-electronic feedback systems like the first pendulum clocks and oxen led by nose rings. He also reviews George’s early work, such as the analog computing he developed for World War II gunnery platforms, and Harold Black’s negative feedback theories.
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Tim Dhuyvetter, Fairchild Semiconductor
Cell phones and other portable electronic products integrate an ear speaker, a headphone speaker, and a near-field speaker (for hands-free operation). Furthermore, reproducing music (MP3 files) and movie soundtracks puts a heavy load on the audio channels. As a result, audio-channel power consumption is no longer a side issue. Increasing the efficiency of audio speaker amplifiers is an important consideration in improving battery runtime.
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Don Tuite, Analog/Power Editor
What’s happening to “standard” analog parts like amplifiers and data converters? The answer can be found by looking at what new products the larger analog semiconductor companies (Analog Devices, Texas Instruments, Linear Technology, Maxim Integrated Products, and Intersil) have announced in the past year to see where they’re placing their bets.
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Don Tuite, Analog/Power Editor
Two sure things will happen in the power market this year. First, somebody will start shipping 600-V gallium-nitride (GaN) FETs. But who will it be? And second, major companies will continue to pursue the potential opportunities in the Smart Grid.
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ED News Staff
Do you have a simple and practical solution to a common design problem? We want to hear about it! And so do our readers, making our Ideas for Design one of the most popular departments in Electronic Design. Submit your idea, and you may see it in an upcoming issue. Contributors receive $150. For details, check out our submission guidelines.
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Barbara Schmitz, MEN Mikro Elektronik
Alternative methods to conventional conduction cooling are necessary to get the heat out of today’s demanding high-performance systems. For example, aluminum board assemblies can be used to fit over critical heat areas. Another method clamps the PCB to an aluminum frame that totally encloses the card.
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From Electronic Design Europe |
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Uwe Jensen, Bergquist Company
Most designers will position thermal materials in electronic assemblies by dispensing cure-in-place gap fillers as automotive electronics, telecom equipment, low-energy lighting, and other sectors demand higher production throughput, thinner bondlines, and reduced mechanical pressure on components and solder joints.
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