Mobile Version   |   Web Version   |   Add us to your Safe Sender List SUBSCRIBE

Electronic Design TOC: The Authority on Emerging Technologies for Design Solutions
In the January 14, 2010 Issue:

Features

HR Execs Say The 2010 Job Market Will Be A Mixed Bag

 Industry Perspective · Ron Schneiderman, Contributing Editor

DC Power Distribution Advances In The Pacific Rim

 Industry Perspective · Jeff Shepard, Contributing Editor

The Market Speaks And The People Listen... And Vice Versa

 Industry Perspective · Tom Curatolo, Contributing Editor

2010 Will Change The Balance In Verification

 Industry Perspective · Frank Schirrmeister, Contributing Editor

Mobile Chips Evolve To Handle Demands Of Smart-Phone Features

 Industry Perspective · Linley Gwennap, The Linley Group

EDA Sputters Along, But Hopefully Better Days Lie Ahead In 2010

 Industry Perspective · Laurie Balch, Gary Smith EDA

2010 Looks Good For VME, VXS, And VPX In Military And Aerospace

 Industry Perspective · Ray Alderman, VITA

Faulty Code Will Lead To An Era Of Firmware-Related Litigation

 Industry Perspective · Michael Barr, Netrino

Emerging Technologies Offer Opportunities For The T&M Industry

 Industry Perspective · Sivakumar Narayanaswamy, Frost & Sullivan

The Information Age Drives COTS Technologies For Automated Test

 Industry Perspective · Richard McDonnell, National Instruments

Three Industry Chip Leaders Track Analog Chip Trends

 Technology Report · Don Tuite, Analog/Power Editor

The Communications Market Will Survive The Downturn

 Technology Report · Louis E. Frenzel, Communications Editor

Power And Display OEMs Will Woodshed In 2010

 Technology Report · Mat Dirjish, Components Editor

Get Ready for Low Power And More Multicore In 2010

 Technology Report · Bill Wong, Embedded/Systems/Software Editor

Verification And Software Dominate EDA’s Future

 Technology Report · David Maliniak, EDA/Test Editor

Expect Even More Options For Embedded Designs

 Technology Report · Bill Wong, Embedded/Systems/Software Editor

MEMS And Nano Push For Higher System Integration Levels

 Technology Report · Roger Allan, Contributing Editor

The Future Looks Bright For 3D Integration

 Technology Report · Francoise Von Trapp, Contributing Editor

For Power Design Opportunities, Try The Smart Grid

 Technology Report · Don Tuite, Analog/Power Editor

Test Equipment Seeks To Stay Ahead Of The Curve

 Technology Report · David Maliniak, EDA/Test Editor

Columns

Woz Never Fails To Fascinate As He Discusses The Future

 Editorial · Joseph Desposito, Editor-in-Chief

What’s All This Leopard Stuff, Anyhow?

 Pease Porridge · Bob Pease

This issue brought
to you by:
JTAG Technologies


SUBSCRIBE TO
Electronic
Design


White Papers
Read White Paper:
Design Considerations for Maximizing Throughput and Accuracy in Switch/Measure Instrumentation

Brought to you by Keithley Instruments, Inc.

Read White Paper:
Achieving Accurate And Reliable Resistance Measurements In Low Power And Low Voltage Applications

Brought to you by Keithley Instruments, Inc.

MORE WHITE PAPERS

Webcasts
Webcast On Demand: A New Approach To Mobile Design That Reduces Dev Time
Learn about trends in display panel and CMOS image sensor technology, high-speed interfaces, and more.
Watch now.
Sponsored by Toshiba

MORE WEBCASTS

Engineering TV

Honeywell T-Hawk Micro Air Vehicle
Published
January 7, 2010

Sponsored by

Subscribe  |  Unsubscribe  |  Change email address  |  Online Version  |  Mobile Version