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December 12, 2007  |   A Penton Media Publication  |   Volume 5 Number 50  
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Integrated, Protected Class D Audio Chipset for High Performance Amplifiers Featuring the new IRS2092 integrated audio driver IC and full complement of digital audio MOSFETs, IR¹s flexible chipset can scale to applications from 50-500W by simply replacing MOSFETs. The audio IC integrates four essential functions for Class D design implementation: error amplifier, PWM comparator, gate driver, and protection circuitry.

www.irf.com/whats-new/nr071002.html


Table Of Contents
IC-Style Modules Shrink Silicon Footprint for Buck Regulators
Energy Efficiency Consortium Announces First Technical Forum
Processing Technologies Enable JP-8 Fuel-Cell System
Semiconductor Firm Opens Circuit Protection Test Lab
Court Postpones Determination on Ultracapacitor Patent Infringement
Stepdown Regulators Integrate Low-RDS(ON) Switches
Buck-Boost Module Operates With High Efficiency
Thin-Film Battery Attains Commercial Availability
Wirewound Inductor Achieves High Current Rating
High-Performance Terminal Blocks Save Time, Space
Events

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Next-Generation Power Management IC Maximizes Energy in Multi-Kilowatt Systems: TI's new UCC28070 is the industry's first single-chip, interleaved power factor correction (PFC) control circuit for multi-kilowatt communications, server and industrial systems. This two-phase, average current-mode controller provides more efficiency, easier design and scales to higher power. ad.doubleclick.net/clk;159467715;22248117;l?http://www.ti.com/pfc



Top Story

IC-Style Modules Shrink Silicon Footprint for Buck Regulators
by David Morrison, Editor, Power Electronics Technology
 International Rectifier's SupIRBuck family of point-of-load regulators co-package controllers and MOSFETs in compact QFN packages, reducing the silicon footprint required to implement single-output, synchronous buck converters.

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Industry News

Energy Efficiency Consortium Announces First Technical Forum
The Green Grid has announced that it will hold its first annual general-members meeting and technical forum, at which attendees will learn about the organization's data-center metrics.

Processing Technologies Enable JP-8 Fuel-Cell System
A recently demonstrated fuel-cell system operating on JP-8 uses a fuel desulfurization system and a fuel reforming system developed at the Department of Energy's Pacific Northwest National Laboratory.

Semiconductor Firm Opens Circuit Protection Test Lab
ON Semiconductor has debuted its Circuit Protection Applications Test Laboratory, which was established to help Asia-Pacific customers speed product development.

Court Postpones Determination on Ultracapacitor Patent Infringement
The United States District Court for the Southern District of California held that it must determine the meaning of patent claim limitations in a NessCap patent before determining whether NessCap's claim of infringement may proceed to trial.

New Products and Services

Stepdown Regulators Integrate Low-RDS(ON) Switches
Maxim Integrated Products' MAX8833/MAX8855 are stepdown regulators that operate from 3.3-V or 2.5-V inputs, provide dual 3-A or dual 5-A outputs (respectively), and integrate low RDS(ON) internal MOSFETs.

Buck-Boost Module Operates With High Efficiency
Linear Technology's LTM4607, the latest member of its μModule family of dc-dc converters, uses a four-switch synchronous MOSFET design to achieve up to 92% efficiency in boost mode, and up to 97.7% efficiency in buck mode.

Thin-Film Battery Attains Commercial Availability
Cymbet has announced commercial availability of its EnerChip thin-film battery products, the first commercial solid-state, highly rechargeable thin-film battery technology for the semiconductor industry.

Wirewound Inductor Achieves High Current Rating
Taiyo Yuden's NR6045T series of wirewound power inductors for choke coils in dc-dc converter applications are rated for currents from 0.8 A to 8.5 A.

High-Performance Terminal Blocks Save Time, Space
Phoenix Contact's SPT 5 pc board terminal blocks provide fast wiring of conductors for power applications in a compact form factor.

Upcoming Events

Events
January 7-10, 2008
International Consumer Electronics Show 2008, Las Vegas
www.cesweb.org



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